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sequence, the device address is transmitted with the R/W bit reset to 0 , followed by the address of the location to which the byte is to be written to. Since the capacity of the EEPROM is 64 Kbytes, a 16-bit address split as MSB address and LSB address is sent next in that order. In the end, the data byte to be written is sent. The sequence is terminated with a Stop sequence. 2. Page Write: Same sequence as the byte write, except that multiple data bytes that are to be written are transmitted before the Stop sequence is issued. 3. Current Address Read: The Start sequence is issued followed by the device address (R/W bit is set to 1 ) and the data byte from the EEPROM is received. Figure 6.45 illustrates the transfer. 4. Random and Sequential Read: This requires a dummy write sequence to precede the actual read. The purpose is to provide the address from where to read the data. The Start sequence is issued followed by a device address that includes the R/W bit reset to 0 to indicate write. Then follows the MSB address and LSB address, and after that a new Start sequence is issued, followed by the device address sequence again with the R/W bit set to 1 to indicate the read operation. After this, the device provides the data from the required location and terminated with a Stop sequence. Since the initial write sequence is not terminated with a Stop sequence, the write to the location is not performed; instead, only the address gets changed. Figure 6.46 illustrates the data transfer

FIGURE 51.31 Laboratories.)

Surface Insulation Resistance (SIR) SIR testing evaluates the electrical resistance between two surface electrical conductors separated by dielectric material. This test detects the bulk conductivity and electrical leakage through surface electrolytic contaminants when the samples are exposed to a high-humidity environment. The test conditions are a relative humidity of 85 to 92 percent at a temperature range of 35 to 45 C without the use of an electrical forcing potential. (See Fig. 51.31 for example of a SIR test pattern.)

Fig 843: Different types of clean room flows: (a) conventional type of clean-room flow, (b) unidirectional flow,

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51.12.3 Moisture and Insulation Resistance (MIR) This is an accelerated method of testing the PCB for the deteriorative effects of condensing high humidity and heat conditions typical of tropical environments. The test conditions are a relative humidity of 90 to 98 percent at a cycling temperature range of 25 to 65 C with a forcing voltage potential of 10 to 100 VDC applied to the test circuit(s). After the required test cycles are completed, the PCB is subjected to insulation resistance testing. Test specimens should exhibit no blistering, measling, warp, or delamination after the moisture resistance test.

51.12.4 Dielectric Withstanding Voltage This test is used to verify that the component part can operate safely at its rated voltage and withstand momentary overpotentials due to switching, surges, and similar phenomena. It also serves to determine whether insulating materials and spacings on the PCB are adequate. The test is performed on either an actual PCB or a test coupon. Voltage is applied between mutually insulated conductors on the specimen or between insulated conductors and power/ ground planes. The voltage is increased at a uniform rate until the specified value is reached. The voltage is held for 30 sec. at the specified value and then reduced at a uniform rate. Visual examination of the specimen is performed during the test for evidence of flashover or breakdown between contacts. The test can be either destructive or nondestructive, depending on the degree of overpotential used.

ECM and CAF Testing ECM and CAF tests are intended to detect the growth of conductive metal filaments on a PCB under the influence of a direct current (DC) voltage bias. This filament growth may occur at either an external or internal interface. Growth of the metal filaments is by electrolytic deposition from a solution containing metal ions that are dissolved from the anode in the test circuit and then transported by the electric field toward the cathode. ECM comes in two forms. First are surface dendrites, which form on the internal or external surfaces between the two test electrodes. The second form of ECM is CAF, in which filaments form along the surface of the glass-fiber reinforcement between a hole and another hole or conductor along the surface of the fiber. ECM and CAF testing is done at a relative humidity of 85 to 92 percent at a steadystate temperature range between 35 to 85 C using forcing potentials ranging from 10 to 100 volts DC during the test.

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