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with time and the temperature gradient The international reference temperature plays a major role in absolute length measurements However, for relative measurements such as geometrical (form) accuracy and surface roughness measurements, it is enough to have a stable temperature Humidity has an effect on the corrosion of ferrous components, volumetric changes in materials such as granite and composite materials, electrostatic charging, wavelength of lasers as in interferometric measurements and the physical comfort of the personnel Vibrations are caused by excitations through forces from within the machine and from outside through the foundation Vibrations lead to dynamic deformations which cause displacements between the component and the tool or the transducer, leading to erroneous sizes or measurements Vibrations of frequencies above 10 Hz can be easily cut off using commercially available vibration mounts and tables The

Detailed specifications may be called out in a drawing or contract, or there may not be any documentation that identifies requirements In the latter case, the recommendation is to revert to accepted industry standards or an internal quality requirement such as a workmanship manual..

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Lead-Free Soldering Any acceptance criteria decision should define lead-free materials and processes acceptability. Until the advent of the European Union s adoption of the Directive on Restriction of Hazardous Substances (RoHS), which went into effect in July 2006, all electronic design and also production control was based on the precedent that soldering processes would be accomplished with tin-lead (SnPb) soldering materials. Tin-lead solder has specific properties that were instrumental in the multitude of component attachment methods that evolved for production of electronics. Had the solder of choice over the years been other than tin-lead, many of these common configurations might have evolved differently. The current reality is that component designs intended for tin-lead attachments are being soldered with various lead-free alloys, driven by the requirement to remove lead from electronic products. Acceptability for these designs has not changed that much, as reflected in current IPC acceptability standards. The attachments still need to have solder that flows over the connection interface surfaces, forms a fillet, and wets to the constituents that form the attachment. What has changed significantly is the surface appearance of the resulting solder connection. Most lead-free solders exhibit surface roughness that would cause concern for those accustomed to the normal appearance of tin-lead. In fact, if solder finishes created by tin-lead had the same surface appearance, they would have rightly been considered contaminated or overheated.The current IPC-A-610 standard provides a side-by-side contrast of similar solder connections accomplished with both tin-lead and lead-free solder alloys for appearance perspectives. Outside of the considerations of acceptability appearance, there are additional concerns for materials compatibility issues and adverse properties such as hot tear, tin whisker, tin pest, accelerated and increased process temperature exposure, and others. These considerations should be developed elsewhere in this reference. This section presents common possibilities for acceptance criteria.

6.14 Interfacing to a Real Time Clock (RTC)

Military, Space, and Commercial Specifications Reference to these types of specifications is common in the applicable markets No great amount of detail will be discussed; however, they are all worthy of some discussion since they can provide a great deal of insight into the rationale of product acceptability and its origin 52121 Military Specifications Military specifications have been widely accepted for use in many markets outside of their intended military products The one with the most relevance to workmanship or acceptability criteria at the assembly level was MIL-STD-2000, a unified standard created from several individual services and production standards It was created to combine the various requirements into a single standard to make it easier for military contractors to implement a single performance requirement.

Many lower-level supporting specifications for components, designs, materials, and printed circuit boards (PCBs) were part of the family of documents to support performance and acceptance requirements as a package Each specification was designed to be compatible with the eventual success of the end product In an effort to increase understanding by all of the parties involved, and to ease compliance issues, the services provided training and certification at various locations throughout the country, and even at some international locations The typical training audience often included customer representatives as well as producersThe title of MIL-STD-2000 was Standard Requirements for Soldered Electrical and Electronic Assemblies However, all of the military soldering requirements standards, including MIL-STD-2000, have been rescinded for future production through DoD acquisition reform initiatives.

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